Koh-Young 3D Inline SPI 8030-3 L

Inspection Technology

Manufacturer
Koh-Young

Type
8030-3 L

Year
2012

Status

                        Very good

Gerber concersion software

Software Package easy-to-use with Touch Screen Service

SPC Plus Software

measurement:

insufficient, too much or no paste

formation of bridges

paste deformation

Volume, hight

XY positions

shadow free measurement with 2 way projection

4 MPix high speed camera, 20µm XY resolution, 0,37µm Z resolution

ca. 60cm²/sec inspection speed

Z-axis tracking

SPC-Plus-Software-package

PCB size max. 510x510mm

automatical width adjustment

SMEMA interface

transport hight 950 +/- 50mm

QR Code recognition

2D recognition of bridges and smudging

Do you have any questions?

Get in contact with us, we look forward to your interest!

TWD GmbH
Thorsten Düvel
Leimberg 22
52222 Stolberg

Telephone: +49 2402 997540
Email: info@twdgmbh.de